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Model Number: 1A1
Brand Name: RDW001-jiawei
Key Specifications/Special Features:
1A1 resin bond diamond grinding wheelsResin binder has a great advantage, a good self-sharpening, sharp cutting, high grinding efficiency, good workpiece surface roughness , less heat, not easy to burn the workpiece, suitable for most workpiece materials efficiency, precision grinding and polishing.The main target: the industry for LED sapphire wafer, the silicon wafer, GaAs, GaN wafer, glass and other products processing industry.Workpiece material: synthetic sapphire, silicon, polycrystalline silicon, gallium arsenide, gallium nitride and other materials.Widely used in coarse grinding material, semi-fine grinding, precision polishing, cutting and more.Could offer various diamond grinding wheels: diameter range 6-900mm, work part thickness 1-400mm, grit range: 20/35-W0.5, and according to customer design and manufacture non-standard products.
Shipping Information:
FOB Port:
China (Mainland)
Lead Time:
7
-
15
days
Main Export Markets:
- Asia
- Australasia
- Central/South America
- Eastern Europe
- Mid East/Africa
- North America
- Western Europe